RP System™ Proven Effectiveness
Copper Solderabilty Conditions: 60ºC 95%RH 21days	42 Alloy Solderabilty Conditions: 60ºC 95%RH 28days
Malleable Iron Test Piece Conditions: Room Temp. 3 years	Sintered Parts Conditions: 60ºC 95%RH 15days
Ceramic Condenser (Silver Plated) Conditions: H2S 15ppm 40ºC 80% RH 32days	Copper Powder for Conductive Paste Conditions: Room Temp. 2 years

Wire Bonding Test
	Preservation Conditions: 85ºC, 85% RH, 2 Weeks
		BREAKING POINTS
		peeling at first bond / BAD breaking at first bond neck / GOOD breaking in loop / GOOD breaking at second bond neck / GOOD peeling at second bond / BAD
	Au plating (0.05 µ m) Electro-plated	Au plating (0.2 µ m) Electro-plated	Ag plating (3 µ m)
	Breaking Strength: >15g Breaking Point: C / GOOD	Breaking Strength: >15g Breaking Point: C / GOOD	Breaking Strength: >15g Breaking Point: C / GOOD
	Breaking Strength: 8g Breaking Point: E / BAD	Breaking Strength: 10g Breaking Point: E / BAD	Breaking Strength: 6g Breaking Point: E / BAD

RP System™ Home	RP System™ A-type	RP System™ K-type
High Gas Barrier Bags	Sealers	Oxygen Indicator
RP System™ Capabilities	RP System™ Effectiveness	Sample Uses for RP System™