More Properties

PROPERTY UNITS CONDITIONS VALUE REFERENCE
Molecular Weight
(or repeat unit)
gmol -1 - 246.31 (1)
Typical molecular weight range gmol -1 End group titration (1.6-4.0)x104 (6)
IR cm-1 Ref. KBr tablet 1,650; 1,550; 1,440;
1,030; 790; 700
(6)
UV nm Ref. 96% H2SO4 260 (7)
1H-NMR ppm Formic acid solution 1.8, 2.5, 4.5, 7.3 (6)
13C-NMR ppm Formic acid solution 25.7, 36.3, 44.7,127.7,
130.0, 138.7, 177.7
(6)
Thermal expansion coefficient K-1 ASTM D696 5.1 x 10-5 (1)
Density (amorphous) gcm-3 296K 1.19 (6)
Solvents - Room temp. Sulfuric acid, formic acid, trifluoroacetic acid, m-cresol, o-cresol,phenol/ ethanol (4:1 by vol.), hexafluoroisopropanol (6)
    433K Benzyl alcohol, ethylene glycol  
    473K Diethylene glycol, triethylene glycol  
Nonsolvents - Room temp. Water, n-butanol, n-heptane  
Crystalline state - Lattice
Space group
Chain conformation
Triclinic
C1i - P1
Planes incline to the c axis by a few degrees from planar zigzag
(5)
Unit call dimensions Å - a = 12.01,b = 4.83, c = 29.8 (5)
Unit cell angles Degrees - = 75.0, = 26.0, = 65.0 (5)
Unit cell contents - - 2 (5)
Degree of crystallinity % Solid phase polymerized,
DSC
35 (6)
Heat of fusion kJ mol-1 DSC 37 (6)
Density (crystalline) g cm-3 - 1.25 (5)
Glass transition temperature K DSC 358 (6)
Melting point K DSC 510 (6)
Heat capacity JK-1g-1 DSC
313K
533K
1.31
2.51
(6)
Deflection temperature K ASTM D648,
1.8 MPa
369 (1)
Tensile modulus MPa ASTM D638 dry 4,700 (1)
Tensile strength MPa ASTM D638 dry 99 (1)
Maximum extensibility (L/L0) % ASTM D638 dry 2.3 (1)
Flexural modulus MPa ASTM D790 dry 4,400 (1)
Flexural strength MPa ASTM D790 dry 160 (1)
Impact strength Jm-1 ASTM D256 dry, notched 20 (1)
Hardness Rockwell M ASTM D785 dry 108 (1)
Abrasion resistance g kcycles-1 ASTM D1044 19 x 10-3 (2)
Index of refraction n - ASTM D542, amorphous 1.582 (6)
Dielectric constant E' - ASTM D150, 110 and 103 MHz 3.9 (2)
Dielectric loss index E" - ASTM D150, 110 and 103 MHz 0.039 (2)
Resistivity ohm cm ASTM D257 1.2 x 1016 (2)
Permeability coefficient m3 (STP) m
s-1 m-2 Pa-1
O2, 296K, 60% RH 5.7 x 10-21 (6)
Thermal conductivity W m-1 K-1 - 0.38 (2)
Melt viscosity Pa s 543K, shear stress 24.5 kPa
Mn = 16,000
Mn = 19,000
Mn = 25,000
Mn = 39,000
140n
280
n
730
n
2,400
n
(1)
Melt index g ASTM D1238, condidtion K
Mn = 16,000
Mn = 19,000
Mn = 25,000
Mn = 39,000
7n
4
n
2
n
0.5
n
(1)
Decomposition temperature K TGA 653 (6)
Water absorption % 293K, equilibrium 5.8 (1)
Important patents - - - (3,4)
Availability kg - 20,000MT
Suppliers Mitsubishi Gas Chemical Co., Inc., Tokyo, Japan
Solvay & Cie, Brussels, Belgium

REFERENCES
1. Mitsubishi Gas Chemical Catalog. Polyamide MXD6.
2. Mitsubishi Gas Chemical Catalog. Reny, Engineering Plastics.
3. Miyamoto, A., et al. U.S. Patents 4 433 136 and 4 438 257 (1984); European Patents 0 071 000 and 0 084 661 (1986)
4. Miyamoto, A., et al. U.S. Patents 3 962 524 and 3 968 071 (1976)
5. Ota, T., M. Yamashita, O. Yoshizaki, and E. Nagai. J. Polymer Sci., Part A-2, 4 (1966): 959.
6. Mitsubishi Gas Chemical Co. Private communications.
7. Tsukamoto, A., H. Nagai, K. Eto, and N. Fujimoto. Kobunshi Kagaku 30 (1973): 339.