Our Products
Our Products
Applications
Effect of RP System®
Wire bonding test at gold plating
After 500 hours in multi-layered aluminum bag
140 ºF, 95% RH. Wire-pull test using 30µm gold line.
With RP System Control
Solderability Test with copper plate
With RP System With DesiccantNo preservative
Solder flew evenly. Uniform adherence in cross-section.
Solder did not flow and adhere in many areas.
Bubbles are seen in cross-section.
Bubbles are seen in cross-section.
Solder did not adhere at all.
Oxidation prevention, Discoloration prevention, Long term preservation
Iron Test Piece
Room Temp, 3 years
Room Temp, 3 years
Sintered Parts
140ºF 95%RH, 15days
140ºF 95%RH, 15days
Ceramic Condenser (Silver Plated)
H2S 15ppm 104ºF 80% RH 32days
H2S 15ppm 104ºF 80% RH 32days
Copper Powder for Conductive
Paste Room Temp. 2 years
Paste Room Temp. 2 years
